Solid state image device and defective pixel recording method thereof

ABSTRACT

The present invention makes it possible to easily and additionally write positional information of the defective pixel which is difficult to deal with using an automated writing mode, and that, without using any special writing jig in the case where a new defective pixel is occurred in a solid state image element.  
     Concretely, a solid state image device in which solid state image means of N lines in the vertical direction and M pixels in the horizontal direction is arranged in a matrix comprises display means for displaying a position of a defective pixel occurred at a solid state image means, position selection means manually operated so as to select the position of the defective pixel on the screen of this display means and memory means for memorizing positional information D 1  of the defective pixel selected by this position selection means. Therefore, if a new defective pixel is occurred in a solid state image means  11  after shipping the product, positional information which is difficult to deal with using the automated writing mode can be easily and additionally written, for example, in the service section without using any special writing jig.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a solid state image device andits defective pixel recording method which is applied to CCD cameraarranging a solid state image element in a matrix shape and in a highdensity and is preferable. More particularly, the present invention ischaracterized in that position selection means for selecting a positionof defective pixel on the screen is provided, this position selectionmeans is manually operated and positional information of selecteddefective pixel is recorded in the memory means, if a new defectivepixel is occurred in a solid state image element after shipping theproduct, without using any special jig for writing, in addition,positional information which is difficult to deal with by the automatedwriting mode has been made easily additionally written.

[0003] 2. Description of the Related Art

[0004] Recently, there have been many cases where a video camera is usedin which a solid state image element (CCD) is arranged in a high densityand in a matrix shape. In this kind of video camera, pixels which arenot normally operated in a certain rate (hereinafter, as referred todefective pixel) are generated and appeared as dotted fixed noises (socalled white and bright defect: white defect) on the screen. It isconsidered that this was occurred because pn junction of lightelectronic conversion element is destroyed or somehow done byintervention of cosmic rays and radiation on the way of traveling aftershipping the product or at the place where the camera is set. Therefore,there have been many cases where defective correction system forremoving its influence by adjusting white defect is mounted in CCDcamera.

[0005] According to the defective correction system 10 of the CCD camera1 shown in FIG. 1, a defective pixel recording method using one time ROMis employed, and an image acquisition information related to defectivepixel is adjusted by memorizing the adjusted data into ROM2. As forwhite defect which is occurred posteriorly, after existing ROM2 isremoved from the CCD camera in step B1 of flowchart shown in FIG. 2, anew ROM2 is set in the writing jig 3. Then, in step B3, the position ofdefective pixel is measured, and after that, in step B4, a correcteddata to an image acquisition information related to defective pixel isprepared, this is written into a new ROM2, and then, in step B5, theROM2 is removed from the writing jig 3 and mounted so as to exchangewith the old ROM2 set in the CCD camera 1.

[0006] Now, according to the defective correction system 10 using onetime ROM, since it needs the writing jig 3 which is exclusive such asROM writer and the like, burden is heavy from the point of view offacilities. Then, a method of mounting a non-volatile memory in the CCDcamera, detecting a position related to defective pixel by scanning onthe screen with camera itself, and employing automatic writing mode inwhich the correction data prepared based on its positional informationis written into a memory is designed.

[0007] However, white defect, which can be dealt with by automaticwriting mode, may remain. For example, there is a problem that it isdifficult to selectively correct white defect as repeating flickeringperiodically, and white defect and the like which cannot be deletedbecause of the limitation of defective correction system.

[0008] It should be noted that the limitation of defective correctionsystem is occurred in a case where correction number related todefective pixel on the identical line is defined, refers to a fact thatdefective pixel exceeding over its correction number of pieces cannot berecorded. Moreover, white defect which could not be deleted due to thelimitation of the defective correction system refers to a portion whichis white and bright due to defective pixels exceeding over thecorrection number of pieces on the same line.

SUMMARY OF THE INVENTION

[0009] The present invention is one, which has resolved suchconventional problems, and an object of the present invention is toprovide a solid state image device and its defective pixel recordingmethod in which positional information of defective pixel are capable ofeasily and additionally being written without using any special writingjig, but are difficult to deal with by an automated writing mode in thecase where a new defective pixel in a solid state image element isoccurred.

[0010] The above described problem is solved by a solid state imagedevice of N lines in the vertical direction and M pixels in thehorizontal direction characterized in that this solid state image deviceis arranged in a matrix shape, comprises display means for displaying aposition of defective pixel occurred at a solid state image element,position selection means manually operated so as to select a position ofdefective pixel on the screen of this display means and memory means formemorizing positional information of defective pixels selected by thisposition selection means.

[0011] According to the solid state image device of the presentinvention, in the case where positional information of a defective pixelis newly recorded, the position of the defective pixel occurred in thesolid state image element is displayed on the screen by the displaymeans. The position selection means is manually operated so as to selectthe position of the defective pixel on the screen of this display means.

[0012] For example, the horizontal cursor is manually operated in thevertical direction on the screen of the display means and the verticalcursor is operated in the horizontal direction on the screen. Manuallyoperated so that the writing determination button is pressed at theintersection of the horizontal cursor and the vertical cursor. Thepositional information of the selected defective pixel is recorded inthe memory means by this position selection means.

[0013] Accordingly, in the case where a new defective pixel is occurredin the solid state image element after shipping the product, positionalinformation of a defective pixel, which is difficult to deal with inautomated writing mode, can be easily written into the memory means in,for example, the service section without using any special writing jig.

[0014] A defective pixel recording method of a solid state image deviceof the present invention is a recording method of a defective pixel inthe solid state image device in which a solid state image element of Nlines in the vertical direction and M pixels in the horizontal directionarranged in a matrix shape, characterized in that a position of adefective pixel occurred in a solid state image element is displayed onthe screen, the position of the defective pixel is selected by manualoperation and the positional information of the defective pixel whichhas been selected here is recorded in the memory means.

[0015] According to a defective pixel recording method of a solid stateimage device of the present invention, since the manual writing modedetermining the writing is carried out, for example, by superimposingthe intersection of the horizontal cursor and the vertical cursor on theposition of the defective pixel on the screen, in the case where a newdefective pixel is occurred in the solid state image element aftershipping the product, the positional information can be easily writtenin the memory means without using any special writing jig. Accordingly,as for a defective pixel occurred posteriorly, it can be also handledwith flexibility.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] For a more complete understanding of the present invention andthe advantages thereof, reference is now made to the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

[0017]FIG. 1 is a perspective drawing showing a constitutive example ofthe defective correction system 10 of the CCD camera 1 of theconventional example;

[0018]FIG. 2 is a flowchart showing a recording example of a defectivepixel in the defective correction system 10 of the present invention;

[0019]FIG. 3 is a block diagram showing an example of the solid stateimage device 100 as one embodiment of the present invention;

[0020]FIG. 4 is a flowchart showing an example of operation of the solidstate image device 100 of the present invention;

[0021]FIG. 5 is a block diagram for one channel showing a constitutiveexample of 3 CCD camera 200 as an example of the present invention;

[0022]FIG. 6 is a conceptual drawing showing an assigned example ofwriting area in the EEPROM 26 of the present invention;

[0023]FIG. 7A and 7B are conceptual drawings showing an example ofcursor display in an example of the cross hair key 28 and the liquiddisplay monitor 33 of the present invention;

[0024]FIG. 8 is a block diagram showing a constitutive example ofdefective correction LSI 25 and its peripheral circuit of the presentinvention;

[0025]FIG. 9 is a block diagram showing an example of internalconstitution of the correction block 57 of the present invention; and

[0026]FIG. 10 is a conceptual drawing showing an example of cursormultiple colors display in the liquid display monitor during Descriptionof the Preferred Embodiments manual writing mode of the presentinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Subsequently, one embodiment of a solid state image device andits defective pixel image recording method of the present invention willbe described below with reference to the drawings.

[0028] (Example 1)

[0029]FIG. 3 is a block diagram showing an example of constitution ofthe solid state image device 100 as one embodiment of the presentinvention.

[0030] In this embodiment, the position selection means for selectingthe position of the defective pixel on the screen is provided, thepositional information of the defective pixel selected by manuallyoperating this position selection means is to record in the memorymeans, in the case where a new defective pixel occurred in the solidstate image element after shipping the product, it is so constitutedsuch that correction of the defective pixel occurred postpriorly can bealso handled with flexibility as well as the positional information ofthe defective pixel which is difficult to deal with by the automatedwriting mode can be easily additionally written without using anyspecial writing jig.

[0031] The solid state image device 100 of the present invention has thesolid state image means 11, comprises a step of the solid state imageelement pij (i=1−N, J=1−M) of N lines in the vertical direction and Mpixels in the horizontal direction being arranged in a matrix shape.Each solid state image element pij is done so that an image acquisitioninformation Din is output. The defective detection means 12 is connectedto the solid state image means 11, the defective detection means 12 isdone so that the defective detection means 12 detects the positionalinformation D1 of the defective pixel occurred in the relevant line ofthe solid state image means 11 during selecting the automated writingmode. Here, the automated writing mode is referred to an operationdetermining the writing by automated scanning of an acquisition imageacquired by the solid state image means 11 and detecting the position ofthe defective pixel.

[0032] In this example, in a state where incident light to the solidstate image means 11 is intercepted, the solid state image means 11 of Nlines× M pixels is line scanned in turn. The defective detection means12 recognizes luminance which each solid state image means 11 hasconverted photoelectorically. Each recognized luminance is compared withthe reference luminance previously determined so that, according to thecomparative results, the positional information D1 of the defectivepixel occurred in the relevant line can be detected.

[0033] To this defective detection means 12, the display means 14 isconnected through the defective correction means 13, the position of thedefective pixel occurred in the solid state image means 11 duringselecting the manual writing mode is displayed, and at the same time,the horizontal cursor Ch and the vertical cursor Cv are displayed on thescreen as well. As used herein, the term “manual writing mode” isreferred to an operation which not only manually operates the horizontalcursor Ch in the vertical direction, but also manually operates thevertical cursor Cv in the horizontal direction, and determines writingby superimposing the intersection of the horizontal cursor Ch and thevertical cursor Cv on the position of the defective pixel.

[0034] To this defective correction means 13, the memory means 16 isconnected through the information writing and reading means 15, thepositional information D1 of the defective pixel occurred in the solidstate image means 11 is recorded by the information writing and readingmeans 15. In this example, the writing area from the first line to theNth line is assigned in the memory means 16 so that the positionalinformation D1 of the defective pixel of m pieces portion per one linecan be previously written. Thus, the positional information D1 of thedefective pixel occurred on the relevant line of the solid state imagemeans 11 may be recorded in the writing area of the memory means 16corresponding to the relevant line. The positional information D1 of thedefective pixel is recorded in the memory means 16 during selecting theautomated writing mode or the manual writing mode.

[0035] To this defective detection means 12, besides the defectivecorrection means 13, the mode selection means 17, the position selectionmeans 18 and the information rewriting means 19 are connected throughthe control means 20. It is operated in the mode selection means 17 sothat any one of the automated writing mode or the manual writing mode isselected, and the mode selection signal S1 is output into the controlmeans 20. It is manually operated in the position selection means 18 sothat the position of the defective pixel on the screen of the displaymeans 14 is selected, and the position selection signal S2 is outputinto the control means 20.

[0036] In the information rewriting means 19, it is operated so that thepositional information D1 of the defective pixel recorded in the memorymeans 16 is deleted and the positional information D1 is rewritten, andthe rewriting signal S3 is output into the control means 20. In thecontrol means 20, the defect detection control information D2, thedefect correction control information D3 and the writing and readingcontrol information D4 are occurred based on the mode selection signalS1, the position selection signal S2 and the rewriting signal S3, thedefect detection means 12 is controlled based on the defect detectioncontrol information D2, the defect correction means 13 is controlledbased on the defect correction control information D3, and theinformation writing and reading means 15 is controlled based on thewriting and reading control information D4.

[0037] In the above described information writing and reading means 15,when the automated writing mode is selected, it is operated so that thepositional information D1 of the defective pixel detected by the defectdetection means 12 based on the writing and reading control informationD4 is recorded in the writing area of the memory means 16 correspondingto the relevant line, and during its correction, the positionalinformation D1 of the defective pixel is read out from the writing area.When the manual writing mode is selected, it is performed so that thepositional information D1 of the defective pixel selected by theposition selection means 18 is recorded in the writing area of thememory means 16 corresponding to the relevant line, and during itscorrection, the positional information D1 is read out from the writingarea.

[0038] The defect correction means 13 is connected to this informationwriting and reading means 15, and as for the image acquisitioninformation Din of the defective pixel recorded in the memory means 16,it is performed so that at least the image acquisition information Dinof the defective pixel is interpolated based on the image acquisitioninformation Din of which locations are in front and in the rear of thedefective pixel due to the solid state image means. The image outputinformation Dout after interpolation is output into the display means 14and the other circuits.

[0039] Subsequently, as for the defective pixel recording method of thesolid state image device 100 of the present invention, an example of anoperation will be described below. FIG. 4 is a flowchart showing anexample of an operation of the solid state image device 100.

[0040] In this embodiment of the present invention, the solid stateimage means 11 of N lines in the vertical direction and M pixels in thehorizontal direction is a recording method of the defective pixel in thesolid state image device 100 arranged in a matrix shape, the position ofthe defective pixel occurred in the solid state image means 11 isdisplayed on the screen, the position of the defective pixel displayedon this screen is manually operated and selected, and supposing the casewhere the positional information D1 of the defective pixel selected hereis recorded in the memory means 16.

[0041] Moreover, when the positional information D1 of the defectivepixel is recorded in the memory means 16, the writing area from thefirst line to the Nth line is prepared in the memory means 16 so as topreviously write the defective pixel of m pieces portion per one line,and subsequently, the case where the positional information D1 of thedefective pixel occurred on the relevant line of the solid state imagedevice 11 is recorded in the writing area of the memory means 16corresponding to the relevant line will be cited.

[0042] On the premise of this, in the case where the positionalinformation D1 of the defective pixel newly occurred, first, the writingmode of the positional information D1 of the defective pixel in the stepA1 of the flowchart shown in FIG. 4 is set. At this moment, in a statewhere incident light to the solid state image means 11 is intercepted,the position of the defective pixel occurred in the solid state imagemeans 11 is displayed by the display means 14 on the screen.

[0043] As for the method of interception of incident light to the solidstate image means 11, for example, the interception is performed suchthat iris of the solid state image device 100 is closed. Subsequently,transfer to the step A2, the positional information D1 of the defectivepixel is recorded corresponding to the case where the manual writingmode is set and the case where the automated writing mode is set.

[0044] (1). A case where the manual writing mode is set:

[0045] In order that the position of the defective pixel displayed onthe screen should be chosen by an operator, transfer to the step A3, thehorizontal cursor Ch and the vertical cursor Cv are displayed at thesame time on the screen of the display means 14. Subsequently, in thestep A4, whether or not the positional information D1 of the defectivepixel of m pieces portion per one line is recorded in the memory means16 is determined. At this moment, whether the record of the positionalinformation D1 of one line is present or absent is determined byaccessing the writing area from the first line to the Nth line.

[0046] In the case where the positional information D1 of the defectivepixel of m pieces portion per one line is not recorded in the memorymeans 16, transfer to the step A6, in order that the position of thedefective pixel should be chosen by an operator, in the display means14, not only the horizontal cursor Ch is manually operated in thevertical direction, but also the vertical cursor Cv is manually operatedin the horizontal direction due to the output of the position selectionmeans 18 which is operated by the operator.

[0047] Then, when the operator superimposes the intersection of thehorizontal cursor Ch and the vertical cursor Cv on the position of thedefective pixel, the determination button of the position selectionmeans 18 is pressed in order to determine the writing in the step A7.Subsequently, in the step A11, the positional information D1 of a newdefective pixel is recorded in the memory means 16.

[0048] It should be noted that in the case where the positionalinformation D1 of the defective pixel of m pieces per one line isrecorded in the memory means 16 in the step A4, the step transferres tothe step A5, and whether or not the positional information D1 of thedefective pixel recorded in the memory means 16 is determined. In thecase where the larger defective pixel than the defective pixel recordedin the memory means 16 is found out, the positional information of thedefective pixel recorded in the memory means 16 is deleted. This is forthe purpose of writing the positional information D1 of a new defectivepixel instead of the old positional information D1.

[0049] Subsequently, transfer to the step A6, in order that the positionof the defective pixel should be selected by an operator, the operatormanually operates the vertical cursor Cv in the horizontal direction.Then, when the operator superimposes the intersection of the horizontalcursor Ch and the vertical cursor Cv on the position of the defectivepixel, the determination button is pressed in order to determine thewriting in the step A7 and whereby the old positional information D1 canbe rewritten to the positional information D1 of a new defective pixelin the step A11.

[0050] (2). A case where the automated writing mode is set:

[0051] In order to automatically detect a defective pixel, transfer tothe step A8, the solid state image means 11 of N lines×M pixels is inturn line-scanned and the defect detection means 12 recognizes theluminance which the respective solid state image means 11 have convertedphotoelectrically. Subsequently, transfer to the step A9, eachrecognized luminance is compared with the reference luminance previouslypredetermined. The positional information D1 of the defective pixeloccurred on the relevant line is detected corresponding to thiscomparison results.

[0052] Here, in the case where each luminance due to the solid stateimage means 11 is larger than the reference luminance previously set,transfer to the step A10, whether or not the positional information D1of the defective pixel of m pieces per one line is already recorded inthe memory means 16 is detected.

[0053] In the case where the positional information D1 of the defectivepixel of m pieces is already recorded in the memory means 16, transferto the step A12. In the case where the positional information D1 of thedefective pixel of m pieces is not recorded in the memory means 16,transfer to the step A11, and the positional information D1 of a newdefective pixel is recorded in the memory means 16. In the case whereeach luminance due to the solid state image means 11 is smaller than thereference luminance previously set, transfer to the step A12, whether ornot the writing of the positional information D1 of the defective pixelis entirely completed is determined. In the case of the manual writingmode, the termination indication from the operator is detected and thenthe writing operation is terminated. In the case of the automatedwriting mode, the termination of the line scanning is detected and thenthe writing operation is terminated. In the case where the writing ofthe positional information D1 of the defective pixel is not entirelycompleted, return to the step A2, and the process from the step A3 tothe step A11 will be continued.

[0054] Accordingly, in the case where a new defective pixel is occurredafter the shipping of the product of the refined solid state image means11, the positional information D1 of the defective pixel which isdifficult to deal with by the automated writing mode can be easilywritten in the memory means 16, for example, in the service sectionwithout using any special writing jig.

[0055] In this embodiment of the present invention, although the casewhere the image acquisition information Din of one channel portion isimage processed has been described above, off course, it can be appliedto the three channel process systems outputting the image acquisitioninformation Dout of red (R), green (G) and blue (B) using 3 CCD camera.

[0056] (Example 2)

[0057]FIG. 5 is a block diagram of one channel portion showing anexample of constitution of a 3 CCD camera as one embodiment of thepresent invention. In this example, the defect detection means 12 shownin FIG. 3, the defect correction means 13 and the information writingand reading means 15 are integrated into one of the defect correctionLSI 25, it is constructed so that the digital picture image signal Dinis passed through, detection of the solid state image element array 21of the defective pixel (flaw) shown in FIG. 5, its correction and cursordisplay is made perform within the identical LSI, and it is made capableof apply to a variety of models of CCD cameras.

[0058] In FIG. 5, although 3 CCD camera 200 has three solid state imagemeans 11 outputting image acquisition information for red, green andblue (hereinafter, referred to as digital picture image signal Din), inthis example, a case of the solid state image means 11 outputting thedigital picture image signal Sin for red will be cited as one exampleand described below.

[0059] The solid state image means 11 has the solid state image elementarray 21, CDS (Co-related Double Sample-hold) circuit 22, AGC (Auto-GainControl) circuit 23 and the analog/digital conversion circuit(hereinafter, referred to as A/D conversion circuit) 24.

[0060] The solid state image element array 21 is consisted of solidstate image elements Pij (i=1−N, j=1−M) of N lines in the verticaldirection and M pixels in the horizontal direction being arranged in amatrix shape. In NTSC method, the number of N is 480 lines, the numberof M is 640 pixels. The CDS circuit 22 is connected to the solid stateimage element array 21, and the noises are removed from the imageacquisition signal Sin. The AGC circuit 23 is connected to the CDScircuit 22, and it is constructed so that the gain of the imageacquisition signal Sin is adjusted. The A/D conversion circuit 24 isconnected to the AGC circuit 23, and the digital picture image signal(image acquisition information) Din after the image acquisition signalSin is A/D converted) is output.

[0061] The defect correction LSI 25 is connected to the A/D conversioncircuit 24, and it is constructed so that the positional information D1of the defective pixel occurred on the relevant line of the solid stateimage element array 21 during selecting the automated writing mode. Thedefect correction LSI 25 is a circuit in which the defect detectionmeans 12, the defect correction means 13, the information writing andreading means 15 and the timing occurrence means (not shown) and thelike are integrated into one of IC chips. In this example, in a statewhere an incident light to the solid state image element array 21 isintercepted, the solid state image element array 21 of 480 lines×640pixels is in turn line-scanned. The defect correction LSI 25 recognizesluminance information according to the respective solid state imagemeans 11. The respective recognized luminance are compared with thereference luminance previously set, so that the positional informationD1 of the defective pixel occurred on the relevant line can be detectedcorresponding to this comparison results.

[0062] A non-volatile memory is connected to this defective correctionLSI 25 as a memory means, and the positional information D1 of thedefective pixel occurred in the solid state image element array 21 isrecorded based on the memory control signal Sm. A parallel type EEPROM26 is used for a non-volatile memory. This type is used because itenables information writing and reading and is suitable for a high-speedperformance.

[0063] Moreover, a microcomputer (hereinafter, referred to asmicroprocessor) 30 for control besides the EEPROM 26 is connected to thedefective correction LSI 25 shown in FIG. 5, and the mode selectionswitch 27, the cross hair key 28 with the determination button and theten-key numeral pad 29 are connected to this microprocessor 30. An inputtool for use in a conventional camera acquisition operation is used forboth of the cross hair key 28 and the ten-key numeral pad 29. The switch27 for mode selection is an example of mode selection means, it isoperated so that either of the automated writing mode or the manualwriting mode is selected, and the mode selection signal S1 is outputinto the microprocessor 30. For example, the mode selection signal S1 ofa high level indicating the automated writing mode is output by turningon the switch 27, and the mode selection signal S1 of a low levelindicating the manual writing mode is output by turning-off the switch27.

[0064] The cross hair key 28 with the determination button is an exampleof position selection means, it is manually operated so that thedefective pixel is selected on the screen of the liquid crystal displaymonitor 33, and the position selection signal S2 is output into themicroprocessor 30. The ten-key numeral pad 29 is an example ofinformation rewriting means, and has numeral keys from “0” to “9”, “*”key and “#” key. For example, the positional information D1 which isrecorded in the EEPROM 26 and is of the defective pixel of the solidstate image means 11 for red color is deleted by “*” key, the numeralkey of “1” is operated so that the positional information D1 of thedefective pixel is rewritten, and the rewriting signal S3 is output intothe microprocessor 30. Similarly, in the case where the positionalinformation D1 of the defective pixel of the solid state image means 11for green color is rewritten, the numeral key of “2” is operated. And inthe case where the positional information D1 of the defective pixel ofthe solid state image means 11 for blue color is rewritten, the numeralkey of “3” is operated.

[0065] In the microprocessor 30, the defect detection controlinformation D2, the defect correction information D3 and the writing andreading control information D4 are occurred base on the mode selectionsignal S1, the position selection signal S2 and the writing signal S3,and the defect correction LSI 25 is controlled based on the defectdetection control information D2, the defect correction LSI 25 iscontrolled based on the defect correction control information D3 and thewriting and reading control information D4.

[0066] In this defect correction LSI 25, in the case where the automatedwriting mode is selected, the positional information D1 of the defectivepixel is recorded in the writing area of the EEPROM 26 corresponding tothe relevant line on the basis of the writing and reading controlinformation D4, and it is operated so that the positional information D1of the defective pixel is read out from the writing area during itscorrection. In the case where the manual writing mode is selected, thepositional information D1 of the defective pixel selected by the crosshair key 28 with the determination button is recorded in the writingarea of the EEPROM 26 corresponding to the relevant line and thepositional information D1 is read out from the writing area during itscorrection.

[0067] Moreover, In the defect correction LSI 25, as for the digitalpicture image signal Din of the defective pixel recorded in the EEPROM26, it is operated so that at least the digital picture image signal Dinof the defective pixel is interpolated on the basis of the digitalpicture image signal Din due to the solid state image element array 21in front and in the rear of the defective pixel. The digital signalprocessor (hereinafter, referred to as DSP) 31 besides the EEPROM 26 andthe microprocessor 30 to this defect correction LSI 25, and the digitalpicture image signal Dout after the interpolation is signal processed.

[0068] The digital/analog conversion circuit (hereinafter, referred toas D/A conversion circuit) 32 is connected to this DSP 31, and thedigital picture image signal Dout is converted into the analog pictureimage signal Sout. The liquid crystal display monitor 33 is connected tothe D/A conversion circuit 32 as a display means, and the position ofthe defective pixel occurred in the solid state image element array 21during selecting the manual writing mode is not only displayed on thescreen on the basis of the analog picture image signal Sout, but alsothe horizontal cursor Ch and the vertical cursor Cv are displayed at thesame time as well.

[0069] On the screen of this liquid display monitor 33, the horizontalcursor Ch is operated in the vertical direction on the basis of theposition selection signal S2 occurred by operating the cross hair key 28with the determination button, and the vertical cursor Cv is operated inthe horizontal direction on the screen. It is operated so that thedetermination button is pressed of the cross hair key 28 at theintersection of this horizontal cursor Ch and the vertical cursor Cv. Itshould be noted that the analog picture image signal Sout after D/Aconversion is also output into the other circuits.

[0070] Subsequently, an example of assignment of the writing area of thepositional information D1 in the EEPROM 26 will be described below. FIG.6 is a conceptual diagram showing an example of assignment of thewriting area in the EEPROM 26.

[0071] In this example, in order to previously write positionalinformation D1 of defective pixel of two pierces per one line the lineshown in FIG. 6 is assigned in the EEPROM 26, and it is performed sothat the positional information D1 of the defective pixel occurred onthe relevant line of the solid state image element array 21 is recordedin the writing area of the EEPROM 26 corresponding to the relevant line.

[0072] In this example, in order to record the positional information D1of the defective pixel of one piece, two bites are assigned. The bitinformation of “FRGB” as a upper order address and the horizontalposition bit B11-B8 are written in byte 1 shown in FIG. 6. Thehorizontal position bit B7-B0 as a lower order address is written in bit2. F flag is a bit information indicating a defective data written atthe time of shipping from the factory. R, G and B flags are bitinformation indicating channels (any one of the solid state image means1 is for red color, green color and blue color) generating a defectivepixel in the 3 CCD camera 200, and the horizontal position bit B0-B11 isa linear address of 12 bits indicating the horizontal positioninformation Dh of the defective pixel. The number of the horizontalpixels is 4096 at the maximum. The positional information D1 of thedefective pixel is recorded in the EEPROM 26 during selecting theautomated writing mode or the manual writing mode.

[0073] Subsequently, an example of the cursor display and an example ofan operation of the cross hair key 28 in the liquid crystal displaymonitor 33 will be described below. For example, the cross hair key 28shown in FIG. 7 has not only the determination button 28E in the center,but also has the triangular key facing rightward 28A, the triangular keyfacing leftward 28B, the triangular key facing upward 28C and thetriangular key facing downward 28D.

[0074] When the triangular key facing rightward 28A is pressed, it isoperated so that the vertical cursor Cv is moved to the right directionon the screen of the liquid crystal display monitor 33 shown in FIG. 7,and when the triangular key facing leftward 28B is pressed, it isoperated so that the vertical cursor Cv is moved to the left directionon the screen. Moreover, when the triangular key facing upward 28C ispressed, it is operated so that the horizontal cursor Ch is moved to theupper direction, and when the triangular key facing downward 28D ispressed, it is operated so that the horizontal cursor Ch is moved to thelower direction. Accordingly, for example, the vertical cursor Cv andthe horizontal cursor Ch can be overlapped at the defective pixel Pijwhich is white and bright. In this state, when the determination button28E is pressed, the writing of the position of the defective pixel tothe EEPROM 26 can be determined.

[0075] Subsequently, an example of an internal constitution of thedefect correction LSI 25 will be described below. The defect correctionLSI 25 shown in FIG. 8 has the serial communication block 51, the memorycontroller block 52, the timing generation block 53, the data writingand reading block 55, the correction signal generation block 56 and thecorrection block 57.

[0076] The serial communication block 51 is connected to themicroprocessor 30 for control described above, and it is operated sothat a serial communication is performed with the microprocessor 30 andvarious kinds of control signals Sc are output into the memorycontroller block 52 and the timing generation block 58. The controlsignal Sc is generated by decoding the defect detection controlinformation D2, the defect correction control information D3 and thewriting and reading control information D4, which have been transferredfrom the microprocessor 30.

[0077] In the timing generation block 53, various kinds of timingsignals used in an internal LSI on the basis of synchronous signal inputinto the relevant defect correction LSI 25. For example, the verticalposition information Dv and the data writing and reading signal WE aregenerated on the basis of the synchronous signal S4. The horizontalposition information Dh is output into the correction signal generationblock 56, the horizontal position information Dh and the verticalposition information Dv are output into the memory controller block 52and the correction block 57, and the data writing and reading signal WEis output into the data writing and reading block 55.

[0078] Moreover, the memory controller block 52 is connected to theserial communication block 51, and it is operated so that the memorycontrol signal Sm and the address are output into the EEPROM 26 on thebasis of the defect determination signal Se, the control signal Sc, thehorizontal position information Dh and the vertical position informationDv, the writing control of the positional information D1 of thedefective pixel is performed, and its reading control is performed. Thedefect determination signal Se is obtained on the basis of thedetermination results which compare the reference value Dr and thedigital picture image signal (image acquisition information) Din forthree color display of R, G and B in the correction block 57constituting the defect detection means, and obtained at the time whenthe position of the defective pixel of the solid state image elementarray 21 is detected.

[0079] The digital picture image signal Din for three colors display isclassified into G data input and B data input and supplied from each ofthe A/D conversion circuit 24 to the correction block 57.

[0080] The data writing and reading block 55 is an example of aninformation writing and reading means, it is operated so that thepositional information D1 at the time when writing to the EEPROM 26 onthe basis of the writing and reading signal WE is held for a while andthe positional information D1 at the time when reading from the EEPROM26 is held for a while. The correction signal generation block 56 isconnected to the data writing and reading block 55, and it is operatedso that the defect correction signal (defect correction pulse) Sr, Sgand Sb for three colors display for R, G, and B are generated on thebasis of the position information D1 due to the data writing and readingblock 55 and the horizontal position information Dh from the timinggeneration block 53.

[0081] The correction block 57 constituting the defect correction meansas well is connected to this correction signal generation block 56, andit is operated so that when the defect correction signals Sr, Sg and Sbof R, G and B respectively are input, straight line interpolation datafor three colors display of R, G and B is generated on the basis offront value and the rear value of the defective pixel of the digitalpicture image signal Din. The straight line interpolation data isgenerated for R correction output, G correction output and B correctionoutput. A digital picture image signal Dout comprising R correctionoutput from this correction block 57 to the liquid crystal displaymonitor 33, G correction output and B correction output is output.

[0082] Subsequently, an example of an internal constitution of thecorrection block 57 of the defect correction LSI 25 will be describedbelow. The correction block 57 shown in FIG. 9 constitutes the digitalpicture signal pass circuit by the solid state image means 11 for redcolor, and simply consisted of 5 pieces of the resisters 71-73, 75 and79, 2 pieces of the data selectors 77, 78, 2 pieces of the adders 76,710, one piece of the comparator 74 and the cursor generation section711. As for the digital picture image signal pass circuit of the solidstate image means 11 for green and blue color, because it takes the sameconstitution with the digital picture image signal pass circuit of thesolid state image means 11 for red color, description for it is omitted.

[0083] In this example, as for the correction method of a defectivepixel, supposing that the digital picture image signal Din of adefective pixel is replaced with mean value of left and right pixel ofthe defective pixel. It should be noted that although correction methodsthemselves of a defective pixel of a variety of methods furtherreferring to upper and lower pixels and diagonal pixels are known, thepresent invention is not limited to these correction methods.

[0084] In the correction block 57 shown in FIG. 9, 3 pieces of theregister 71-73 are cascaded (subordinately). Specifically, it isoperated so that an output O of the first register 71 is connected to aninput D of the second register 72, an output O of the register 72 isconnected to an input D of the third register 73, and when the digitalpicture image signal Din is input into the register 71, the three pixelsportion consecutive to the horizontal direction is held at the same timein 3 pieces of the registers 71-73.

[0085] The comparator 74 is connected to the output O of this register72, when the automated writing mode is performed, luminance value of thecentral pixel and the reference value Dr input as a threshold value arecompared, and whether or not the digital picture image signal Din due tothe relevant pixel is the digital picture image signal Din due to thedefective pixel is determined. The register 75 is connected to thecomparator 74, in the case where the relevant digital picture imagesignal Din is due to a defective pixel, a defect determination signal Seindicating that the defective pixel is detected is held.

[0086] Since this defect determination signal Se is output into thememory controller block 52, described in FIG. 8, it is operated so thatin the memory controller block 52 the horizontal and vertical countervalues are held on the basis of the defect determination signal Se, andthe positional information D1 of the defective pixel is written in theEEPROM 26 on the basis of this.

[0087] Moreover, it is operated so that an output O of register 71 isnot only connected to an input b of the adder 76, an output O of theregister 73 is connected to an input a of the adder 76 as well, and themean value of both lateral pixels of the central pixel is always output.It is operated so that an output of the adder 76 is connected to aninput a of the data selector 77, an output O of the register 72 isconnected to an input b of the data selector 77, and any one of anoutput of the adder 76 or an output of the register 72 is selected onthe basis of the defect correction signal Sr input from the correctionsignal generation block 56. It should be noted that in the automatedwriting mode a defect correction signal Sr is stopped and if there is adefective pixel, immediately it becomes such a state that the digitalpicture image signal Dout of the defective pixel is output from the dataselector 77.

[0088] The correction signal generation block 56 is connected to acontrol input S of this data selector 77, and it is operated so thatwhen the digital picture image signal Din of the defective pixel is justheld during correction operation, a defect correction signal Sr isgenerated. For example, in the correction signal generation block 56, adefect correction signal Sr is generated by comparing the horizontal andvertical counter values synchronized with the digital picture imagesignal Din and the positional information D1 from the EEPROM 26. At thismoment, the data selector 77 selecting the central pixel side b so faris switched to the average value side a on the basis of a defectcorrection signal Sr, whereby the data selector 77 will output thedigital picture image signal Dout instead of the digital picture imageDout of the defective pixel and adjusted.

[0089] An input a of the adder 710 is connected to an output of the dataselector 77, a cursor display luminance signal S5 is supplied to aninput b of this adder 710, and it is operated so that a cursor displayluminance signal S5 is superimposed on the digital picture image signalDout of the defective pixel. Moreover, an input a of the second dataselector 78 is connected to an output of the data selector 77, and aninput b of the data selector 78 is connected to this adder 710 it isoperated so that any one of a digital picture image signal Dout of thedefective pixel superimposed on a cursor display luminance signal S5based on a cursor display pulse S6 or a digital picture image signalDout after correction but without superimposing on a cursor displayluminance signal S5 is selected.

[0090] The adder 710 provided between the data selector 77 and the dataselector 78 may be omitted. In the case where the adder 710 is provided,even if a white and bright defective pixel and the horizontal cursor Chand the vertical cursor Cv are superposed, the position of the defectivepixel can be clearly indicated. In the case where the adder 710 is notprovided, at the time when the horizontal cursor Ch and the verticalcursor Cv are superimposed on a white and bright defective pixel, it isoperated so that the display due to the defective pixel is deleted. Itcan be an index determining whether or not the horizontal cursor Ch andthe vertical cursor Cv are superimposed on the defective pixel.

[0091] The cursor generation section 711 is connected to a control inputS of the data selector 78, and a cursor display pulse S6, whichsynthesizes a horizontal cursor display signal generated by comparingthe register value indicating the position of the horizontal cursor Chand a vertical counter value synchronous with a digital picture imagesignal Din, is generated. An output of the adder 76 or an output of theregister 72 is selected by this cursor display pulse S6. In the timinggeneration section 53, the horizontal counter value and the verticalcounter value are obtained on the basis of a control signal Sc decodinga defect detection control information D2 sent to the serialcommunication block 51, a horizontal position information Dh and avertical position information Dv occurred in the timing generation block53. It should be noted that it will be good that the cursor generationsection 711 is incorporated together inside of the timing generationsection 53.

[0092] Subsequently, a cursor display signal S5 can be superimposed onthe picture image by switching the data selector 78 due to the cursordisplay pulse S6. In this case, the intersection of the horizontalcursor Ch and the vertical cursor Cv is superimposed on the position ofthe defective pixel by the manual operation using the cross hair key 28with the determination button, and the when determination button 28E ispressed, then, the register value in the cursor generation section 711at the time indicates the position of the defective pixel, therefore,the positional information D1 of the defective pixel can be written inthe EEPROM 26 on the basis of this register value.

[0093] Subsequently, an example of cursor display during the manualwriting mode extended for three channels of R, G and B will be describedbelow. The display positions of the horizontal cursor Ch and thevertical cursor Cv shown in FIG. 10 can be moved upward and downward,and leftward and rightward on the basis of a cursor display luminancesignal S5 and a cursor display pulse S6 due to the cursor generationsection 711, and the positional information D1 (correction data) of thedefective pixel can be additionally written by superimposing theintersection of the cursors on the white and bright defective pixel thatthe operator wants to adjust and sending a writing command.

[0094] As for this example, this is a case where picture images aredivided into three of red, green and blue colors concerning with thesolid state image element array 21 and acquired, the horizontal cursorCh operated in the vertical direction on the screen of the liquiddisplay monitor 33 is displayed in white and the vertical cursor Cvoperated in the horizontal direction on the screen is displayed in red,green or blue color.

[0095] In this example, the writing operation of the positionalinformation D1 of the defective pixel is performed at every one channel.Therefore, RGB flag for channel designation is provided in upper addressshown in FIG. 6 as a control command. For example, when flagging R flagand entering into the manual writing mode, as for the vertical cursor Cvoperated in the horizontal direction on the screen of the liquid displaymonitor 33, correction point marker Cr of red color is lighted anddisplayed in the case of the position of the defective pixel of redcolor already recorded in the EEPROM 26.

[0096] As for the position of the defective pixel of red color to berecorded in the EEPROM 26 from now on, in order to distinguish from themarker Cr, the vertical cursor Cv is lighted and displayed in red color.Green and blue colors are also similarly lighted and displayed orflickered and displayed. In this way, since the horizontal and verticalcursors themselves have channel display function, the position of thedefective pixel is easily retrieved.

[0097] Subsequently, an example of an operation of the defective pixelrecording method of the 3 CCD camera 200 of the present invention willbe described below. It should be noted that a flowchart of an example ofan operation of the solid state image device 100 shown in FIG. 4 will beagain referred to.

[0098] In this example, supposing a case of a recording method of adefective pixel in the 3 CCD camera for red, green and blue colors, inwhich the solid state image element Pij of 480 lines in the verticaldirection and 640 pixels in the horizontal direction is arranged in amatrix shape, and in which the position of the defective pixel occurredin the respective solid state image means 11 for red, green and bluecolors is displayed in time dividing on the screen, the position of thedefective pixel displayed on the screen is manually operated andselected and the positional information D1 of the defective pixelselected here is recorded in the EEPROM 26.

[0099] Moreover, a case is cited in which, at the time when thepositional information D1 of the defective pixel is recorded in theEEPROM 26, the writing area from the first line to the 480^(th) line isprepared in the EEPROM 26 so that 2 pieces portion of the defectivepixels per one line is previously written, and subsequently, forexample, the positional information D1 of the defective pixel occurredon the relevant line of the solid state image means 11 for red color isrecorded in the EEPROM 26 corresponding to the relevant line.

[0100] On the premise of this, in the positional information D1 of thedefective pixel newly occurred is recorded, first, the writing mode isset using the mode selection switch 27 shown in FIG. 5 in the step A1 ofthe flowchart shown in FIG. 4. At this instance, in a state where anincident light to the relevant 3 CCD camera 200 is intercepted, theposition of the defective pixel occurred in the solid state image means11 for red color is displayed on the screen by the liquid crystaldisplay monitor 33. Subsequently, transfer to the step A2, thepositional information D1 of the defective pixel is recorded in theEEPROM 26 corresponding to the case where the manual writing mode isset, and the case where the automated writing mode is set.

[0101] (1). A case where the manual writing mode is set:

[0102] In order that the position of the defective pixel displayed onthe screen should be selected by an operator, transfer to the step A3,the horizontal cursor Ch and the vertical cursor Cv are displayed at thesame time on the screen of the liquid crystal display monitor 33. Inthis manual writing mode, in the correction block 57 shown in FIG. 9,when the digital picture image signal Din is input into the register 71,it is operated so that the digital picture image signal Din of 3 pixelsportion consecutive in the horizontal direction is held in 3 pieces ofthe registers 71˜73. In the adder 76, it is constituted so that theaverage value of both lateral pixels of the central pixel is alwaysoutput, but in the manual writing mode, a defective correction signal Sris stopped, and if there is a defective pixel, immediately it becomes toa state where the digital picture image signal Dout of the defectivepixel is output into the data selector 77.

[0103] Furthermore, in the adder 710, it is operated so that a cursordisplay luminance signal S5 is superimposed on the digital picture imagesignal Dout of the defective pixel, whereby in the manual writing mode,the horizontal cursor Ch and the vertical cursor Cv are superimposed onthe digital picture image signal Din and can display it.

[0104] Subsequently, in the step A4, whether or not the positionalinformation D1 of the defective pixels of 2 pieces per one line isrecorded in the EEPROM 26 is determined. At this moment, whether thepositional information D1 of one line is present or not is determined byaccessing the writing area from the first line to the 480^(th) line.

[0105] In the case where the positional information D1 of the defectivepixels of 2 pieces portion per one line is not recorded in the EEPROM26, transfer to the step A6, in order that the position of the defectivepixel should be made selected, according to an output of the cross hairkey 28 with the determination button operated by the operator, not onlythe horizontal cursor Ch is manually operated in the vertical directionand but also the vertical cursor Cv is manually operated in thehorizontal direction.

[0106] Then, when the operator superimposes the intersection of thehorizontal cursor Ch and the vertical cursor Cv on the position of thedefective pixel, the determination button 28E of the cross hair key 28is pressed in order to determine the writing in the step A7.Subsequently, the positional information D1 of a new defective pixel isrecorded in the EEPROM 26.

[0107] It should be noted that, in the step A4, in the case where thepositional information D1 of the defective pixels of 2 pieces per oneline is already recorded in the EEPROM 26, transfer to the step A5, andwhether or not the positional information D1 of the defective pixelrecorded in the EEPROM 26 is determined. In the case where a defectivepixel larger than the defective pixel recorded in the EEPROM 26 is foundout, the positional information D1 of the defective pixel recorded inthe EEPROM 26 is deleted. This is for the purpose of the positionalinformation D1 of a new defective pixel instead of the old positionalinformation D1 is written.

[0108] Subsequently, transfer to the step A6, in order that the positionof the defective pixel should be selected, the operator manuallyoperates not only the horizontal cursor Ch in the vertical direction,and manually operates but also the vertical cursor Cv in the horizontaldirection. Then, when the operator superimposes the intersection of thehorizontal cursor Ch and the vertical cursor Cv on the position of thedefective pixel, in the step A7, the determination button 28E is pressedin order to determine the writing, whereby in the step A11, the oldpositional information D1 can be rewritten into the positionalinformation D1 of a new defective pixel.

[0109] (2). A case where the automated writing mode is set:

[0110] In order to automatically detect a defective pixel, transfer tothe step A8, the solid state image means 11 for red color of 480lines×640 pixels is in turn line-scanned by the correction block 57, andthe luminance which the respective solid state image means 11 haveconverted photoelectrically is measured. Subsequently, transfer to thestep A9, respective luminance due to the solid state image means 11 arecompared with the reference value Dr previously set. The positionalinformation D1 of the defective pixel occurred on the relevant line isdetected corresponding to the comparative results. Here, in the casewhere the respective luminance is larger than the reference value Drpreviously set, transfer to the step A10, and whether or not thepositional information D1 of the defective pixels of 2 pieces per oneline is already recorded in the EEPROM 26 is detected.

[0111] In the case where the positional information D1 of the defectivepixels of 2 pieces is already recorded in the EEPROM 26, transfer to thestep A12. In the case where the positional information D1 of thedefective pixels of 2 pieces is not recorded in the EEPROM 26, transferto the step A11, the positional information D1 is recorded in the EEPROM26.

[0112] At this moment, in the correction block 57, when the digitalpicture image signal Din is input into the register 71, it is operatedso that the digital picture image signal Din of the 3 pieces portionconsecutive in the horizontal direction in the 3 pieces of the register71-73. In this automated writing mode, whether or not the digitalpicture image signal Din due to the relevant pixel is the digitalpicture image signal Din due to the defective pixel is determined bycomparing luminance value of the central pixel and the reference valueDr. In the case where the relevant digital picture image signal Din isdue to defective pixel, a defect determination signal Se indicating thatthe defective pixel is detected is held.

[0113] Since this defect determination signal Se is output into thememory controller block 52 shown in FIG. 8, it is operated so that inthe memory controller block 52, the horizontal and vertical countervalues are held on the basis of the defect determination signal Se, andthe positional information D1 of the defective pixel is written in theEEPROM 26 on the basis of this. It should be noted that in the automatedwriting mode, the defect correction signal Sr is stopped, if there is adefective pixel, immediately it becomes a state where the digitalpicture image signal Dout of the defective pixel is output from the dataselector 77.

[0114] Moreover, the respective luminance due to the solid state imagemeans 11 for red color is smaller than the reference value Dr previouslyset, transfer to the step A12, whether or not the writing of thepositional information D1 of the defective pixel is entirely completedis determined. In the case of the manual writing mode, the terminationinstruction from the operator is detected and the writing operation isterminated. In the case of the automated writing mode, the terminationof the line scanning is detected, and the writing operation isterminated. In the case where the positional information D1 of thedefective pixel is not entirely completed, return to the step A2, theprocess of the step A3˜A11 will be continued.

[0115] As for the correction process of the defective pixel, in thecorrection block 57 shown in FIG. 9, when the digital picture imagesignal Din is input into the register 71, it is operated so that thedigital picture image signal Din of 3 pixels consecutive in thehorizontal direction in the 3 pieces of the register 71˜73. In the adder76, it is operated so that the average value of both of lateral pixelsof the central pixel is always output. In the first data selector 77, itis operated so that either of an output of the adder 76 or an output ofthe register 72 is selected on the basis of the defective correctionsignal Sr.

[0116] When the digital picture image signal Din of the defective pixelis just held in the register 72 during correction operation in the dataselector 77, it is operated so that the defect correction signal Sr isgenerated in the correction signal generation block 56. At thisinstance, in the correction signal generation block 56, the defectcorrection signal Sr is generated by comparing the horizontal countervalue and the vertical counter value which are synchronized with thedigital picture image signal Din and the positional information D1 fromthe EEPROM 26.

[0117] The data selector 77 selecting the central pixel side b so far isswitched to the average value side a on the basis of the defectcorrection signal Sr, whereby the data selector 77 will output thedigital picture image signal Dout adjusted and instead of the digitalpicture image signal Dout of the defective pixel. In the second dataselector 78, it is operated so that the digital picture image signalDout not superimposing on the cursor display luminance signal S5 as itis after correction is selected on the basis of the cursor S6.Accordingly, in the case where an image acquisition information due to ared and bright defective pixel is included in the digital picture imagesignal Sin, the digital picture image signal Dout removing the imageacquisition information due to the defective pixel from the pictureoutput information by the correction operation can be output.

[0118] In this way, in the present embodiment of the present invention,when the defect correction system is made to be an integrated circuit,the manual writing mode besides the automated writing mode is provided,therefore, in the case where a new defective pixel is occurred aftershipping the product of the finely manufactured 3 CCD camera 200, thepositional information D1 can be easily written in the EEPROM 26 fordefective pixel which cannot be dealt with in the automated writing mode(a white and bright pixel such as one repeating flickering periodicallyand a defective pixel which cannot be deleted from the limitation of thedefect correction circuit and the like) without using any specialwriting jig.

[0119] Moreover, according to the present embodiment, since all of thedefect correction, detection and cursor display can be carried outwithin the identical defect correction LSI 25, it does not need anysevere timing control at all, a defect correction system of selfcompleted type which is not influenced with certain system delay at allcan be constituted. Accordingly, the relevant defect correction systemcan be easily mounted on various kinds of models of CCD cameras.

[0120] In this example, although the case where as for the number of thedefective pixel adjustable per one line, m, the expression m=2 is held,has been described, it is not limited to this, and it will be good thata defect correction system dealing with more than two defective pixelsper one line. Moreover, it will be good that the liquid crystal displaymonitor 33 is embedded within the 3 CCD camera just like a video camera,and it will be also good that it is connected to the outside just likeindustrial camera.

[0121] Briefly, the positional information D1 of the defective pixel canbe written in the EEPROM 26 without using any special jig except a CCDcamera and a monitor. Therefore, the service section can easily dealwith the defective pixel occurred, for example, in the market afterstarting the sales of the cameras. It is not necessary to keep anexclusive jig.

[0122] By the way, if a manual writing mode is performed using anexclusive jig in the outside of the 3 CCD camera, defect correctionsignals Sr, Sg and Sb accurately adjusting a system delay portion fromthe point performing the correction within its camera to camera outputmust be prepared. At this point, since its correction amount per cameramodel is defined in a self completed manner according to methods of thepresent invention, the problem of owning jointly a common writing jig isalso cleared.

[0123] As described above, according to solid state image devices of thepresent invention, a position selection means manually operated isprovided so as to select a defective pixel on the screen, and it isoperated so that the positional information selected here is recorded inthe memory means.

[0124] Accordingly, in the case where a defective pixel is occurredafter shipping the product of the finely manufactured solid state imageelement, the positional information of the defective pixel can be easilywritten in memory means without using any special jig.

[0125] According to defective pixel recording methods of solid stateimage devices of the present invention, the devices are operated so thatthe position of the defective pixel occurred in the solid state imageelement is displayed on the screen, after the position of the defectivepixel indicated on the screen is manually operated and selected, thepositional information of the defective pixel selected here is recordedin memory means.

[0126] Accordingly, in the case where a defective pixel is occurredafter shipping the product of a finely manufactured solid state imageelement, the positional information of the defective pixel can bewritten in memory means without using any special writing jig. Inaddition, as for correction for a defective pixel occurred posteriorly,it is can be handled with flexibility.

[0127] The present invention is extremely preferable to apply it to CCDcameras arranging solid state image elements in a high density and in amatrix shape.

What is claimed is:
 1. A solid state image device in which solid stateimage elements of N lines in vertical direction and M pixels inhorizontal direction are arranged in a matrix shape, said solid stateimage device comprising: display means for displaying a position of adefective pixel occurred in said solid state element on a screen,position selection means for being manually operated so as to select aposition of a defective pixel on a screen of said display means, andmemory means for recording positional information of a defective pixelselected by said position selection means.
 2. A solid state image deviceaccording to claim 1 , wherein said position selection means has,horizontal cursor operated in vertical direction on a screen of saiddisplay means, vertical cursor operated in horizontal direction on saidscreen, and writing determination button operated so as to be pressed atan intersection of said horizontal cursor and vertical cursor.
 3. Asolid state image device according to claim 1 , wherein as for saidsolid state image element, a case where an image is divided into threeof red, green and blue and acquired, in said case, a horizontal cursoroperated in vertical direction on a screen of said display means isdisplayed in white, and a vertical cursor operated in horizontaldirection on said screen is displayed in red, green or blue color.
 4. Asolid state image device according to claim 1 , wherein as for verticalcursor operated in horizontal direction on a screen of said displaymeans, a position of a defective pixel already recorded in said memorymeans is lighted and displayed in red, green or blue color, a positionof a defective pixel about to be recorded in said memory means from nowis flickered and displayed in red, green and blue color.
 5. A solidstate image device according to claim 1 , wherein a case where anoperation determining a writing by superimposing an intersection of saidhorizontal cursor and said vertical cursor on a position of saiddefective pixel is made as a manual writing mode, an operationdetermining a writing by detecting a position of said defective pixeland automatically scanning an acquisition image acquired by said solidstate image element is made as an automated writing mode, and modeselection means for selecting either of said automated writing mode orsaid manual writing mode is provided.
 6. A solid state image deviceaccording to claim 1 , wherein a writing area from first line to the Nline is assigned so as to previously write positional information ofdefective pixels of m pieces portion per one line, and it is performedso that positional information of a defective pixel occurred on therelevant line of said solid state image element is recorded in a writingarea corresponding to the relevant line of said memory means.
 7. A solidstate image device according to claim 1 , wherein defect detection meansfor detecting positional information of a defective pixel occurred onthe relevant line of said solid state image element, and informationwriting and reading means for recording positional information of adefective pixel detected by said defect detection means in a writingarea of said memory means corresponding to the relevant line and readingpositional information from said writing area are provided.
 8. A solidstate image device according to claim 1 , wherein information rewritingmeans for deleting positional information of a defective pixel recordedin said memory means and rewriting the relevant positional informationis provided.
 9. A solid state image device according to claim 1 ,wherein in said defect detection means, line scanning in turn a solidstate image element of N lines and M pixels and measuring luminance byrespective solid state image element in a state where an incident lightto said solid state image element is intercepted, comparing respectiveluminance by said solid state image element and reference luminancepreviously set, and detecting positional information of a defectivepixel occurred on the relevant line corresponding to said comparativeresults.
 10. A solid state image device according to claim 1 , whereinas for image acquisition information of a solid state image element of adefective pixel recorded in said memory means, at least defectcorrection means for interpolating image acquisition information of asolid state image element of said defective pixel is provided based onimage acquisition information by solid state image elements in front andin the rear of said defective pixel.
 11. A defective pixel recordingmethod in a solid state image device in which solid state image elementsof N lines in vertical direction and M pixels in horizontal directionare arranged in a matrix shape, wherein displaying a position of adefective pixel occurred in said solid state image element on a screen,manually operating and selecting a position of a defective pixeldisplayed on said screen, and recording positional information of saidselected defective pixel in memory means.
 12. A defective pixelrecording method of a solid state image device according to claim 11 ,wherein when a position of a defective pixel displayed on said screen isselected, displaying horizontal cursor and vertical cursor on saidscreen simultaneously, manually operating not only said horizontalcursor in vertical direction and manually operating but also saidvertical cursor in horizontal direction, and determining a writing bysuperimposing an intersection of said horizontal cursor and verticalcursor on a position of said defective pixel.
 13. A defective pixelrecording method of a solid state image device according to claim 11 ,wherein when a defective pixel which is larger than a defective pixelrecorded in said memory means, I sdetected positional information of adefective pixel recorded in said memory means is deleted and rewritteninto new positional information.
 14. A defective pixel recording methodof a solid state image device according to claim 11 , wherein whenpositional information of said defective pixel is recorded in memorymeans, preparing a writing area from first line to Nth line in saidmemory means so as to previously write defective pixels of m piecesportion per one line, and subsequently, recording positional informationof a defective pixel occurred on the relevant line of said solid stateimage element in a writing area of said memory means corresponding tothe relevant line.